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 SUM40N15-38
New Product
Vishay Siliconix
N-Channel 150-V (D-S) 175_C MOSFET
FEATURES PRODUCT SUMMARY
V(BR)DSS (V)
150
rDS(on) (W)
0.038 @ VGS = 10 V 0.042 @ VGS = 6 V
ID (A)
40 38
D D D D
TrenchFETr Power MOSFETS 175_C Junction Temperature New Low Thermal Resistance Package PWM Optimized
APPLICATIONS
D Primary Side Switch
D
TO-263
G
G
DS S N-Channel MOSFET
Top View Ordering Information: SUM40N15-38
ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 175_C) Pulsed Drain Current Avalanche Current Repetitive Avalanche Energya Maximum Power Dissipationa Operating Junction and Storage Temperature Range L = 0.1 mH TC = 25_C TA = 25_Cc TC = 25_C TC = 125_C
Symbol
VDS VGS ID IDM IAR EAR PD TJ, Tstg
Limit
150 "20 40 23 80 40 80 166b 3.75 - 55 to 175
Unit
V
A
mJ W _C
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB Mount Junction-to-Case (Drain) Notes a. Duty cycle v 1%. b. See SOA curve for voltage derating. c. When mounted on 1" square PCB (FR-4 material). Document Number: 72155 S-03534--Rev. A, 24-Mar-03 www.vishay.com TO-263c)
Symbol
RthJA RthJC
Limit
40 0.9
Unit
_C/W
1
SUM40N15-38
Vishay Siliconix
New Product
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter Static
Drain-Source Breakdown Voltage Gate-Threshold Voltage Gate-Body Leakage V(BR)DSS VGS(th) IGSS VDS = 0 V, ID = 250 mA VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 120 V, VGS = 0 V Zero Gate Voltage Drain Current g IDSS VDS = 120 V, VGS = 0 V, TJ = 125_C VDS = 120 V, VGS = 0 V, TJ = 175_C On-State Drain Currenta ID(on) VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 15 A Drain-Source On-State Drain Source On State Resistancea VGS = 6 V, ID = 10 A rDS( ) DS(on) VGS = 10 V, ID = 15 A, TJ = 125_C VGS = 10 V, ID = 15 A, TJ = 175_C Forward Transconductancea gfs VDS = 15 V, ID = 15 A 10 80 0.030 0.033 0.038 0.042 0.076 0.100 S W 150 V 2 4 "100 1 50 250 A m mA nA
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Chargec Gate-Source Chargec Gate-Drain Chargec Turn-On Delay Timec Rise Timec Ciss Coss Crss Rg Qg Qgs Qgd td(on) tr td(off) tf VDD = 75 V, RL = 1.80 W ID ^ 40 A, VGEN = 10 V, RG = 2.5 W VDS = 75 V, VGS = 10 V, ID = 40 A , , VGS = 0 V, VDS = 25 V, f = 1 MHz 2500 290 190 2 38 13 13 15 130 30 90 25 200 45 140 ns 60 nC W pF
Turn-Off Delay Timec Fall Timec
Source-Drain Diode Ratings and Characteristics (TC =
Continuous Current Pulsed Current Forward Voltagea Reverse Recovery Time Peak Reverse Recovery Current Reverse Recovery Charge IS ISM VSD trr IRM(REC) Qrr
25_C)b
40 80 IF = 40 A, VGS = 0 V 1.0 100 IF = 40 A, di/dt = 100 A/ms , m 5 0.25 1.5 150 8 0.6 A V ns A mC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature.
www.vishay.com
2
Document Number: 72155 S-03534--Rev. A, 24-Mar-03
SUM40N15-38
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
80 VGS = 10 thru 7 V I D - Drain Current (A) I D - Drain Current (A) 60 6V 60 80
Vishay Siliconix
Transfer Characteristics
40
40
TC = 125_C 20 25_C - 55_C 0
20 5V 0 0 2 4 6 8 10
0
1
2
3
4
5
6
7
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Transconductance
80 TC = - 55_C 60 125_C 40 r DS(on) - On-Resistance ( W ) 25_C g fs - Transconductance (S) 0.06 0.08
On-Resistance vs. Drain Current
VGS = 6 V VGS = 10 V 0.04
20
0.02
0 0 10 20 ID - Drain Current (A) 30 40
0.00 0 20 40 ID - Drain Current (A) 60 80
Capacitance
4000 20
Gate Charge
3200 C - Capacitance (pF) Ciss
V GS - Gate-to-Source Voltage (V)
16
VDS = 75 V ID = 40 A
2400
12
1600
8
800
Crss
4
Coss
0 0 25 50 75 100 125 150
0 0 15 30 45 60 75
VDS - Drain-to-Source Voltage (V) Document Number: 72155 S-03534--Rev. A, 24-Mar-03
Qg - Total Gate Charge (nC) www.vishay.com
3
SUM40N15-38
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature
2.7 2.4 r DS(on) - On-Resistance (W) (Normalized) 2.1 1.8 1.5 1.2 0.9 0.6 0.3 - 50 1 0 VGS = 10 V ID = 15 A I S - Source Current (A) 100
Source-Drain Diode Forward Voltage
TJ = 150_C 10 TJ = 25_C
- 25
0
25
50
75
100
125
150
175
0.3
0.6
0.9
1.2
TJ - Junction Temperature (_C)
VSD - Source-to-Drain Voltage (V)
Drain Source Breakdown vs. Junction Temperature
195
185 V (BR)DSS (V)
ID = 1 mA
175
165
155
145 - 50
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (_C)
www.vishay.com
4
Document Number: 72155 S-03534--Rev. A, 24-Mar-03
SUM40N15-38
New Product
THERMAL RATINGS
Vishay Siliconix
Maximum Avalanche and Drain Current vs. Case Temperature
45 1000
Safe Operating Area
Limited by rDS(on) 100 I D - Drain Current (A) 10 ms 100 ms 10 1 ms 10 ms 1 TC = 25_C Single Pulse dc, 100 ms
36 I D - Drain Current (A)
27
18
9
0 0 25 50 75 100 125 150 175
0.1 0.1 1 10 100 1000
TC - Ambient Temperature (_C)
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Case
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02 Single Pulse
0.01 10 -4
10 -3
10 -2
10 -1
1
10
Square Wave Pulse Duration (sec)
Document Number: 72155 S-03534--Rev. A, 24-Mar-03
www.vishay.com
5


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